The following text field will produce suggestions that follow it as you type.

Barnes and Noble

Reliability and Failure Analysis of High-Power LED Packaging

Unfortunately, this item is no longer available, but we found some similar items you might like.
Solid State Lighting Reliability: Components to Systems
Barnes and Noble

Solid State Lighting Reliability: Components to Systems

From Barnes and Noble
Risk and Failure Analysis for Improved Performance and Reliability
Barnes and Noble

Risk and Failure Analysis for Improved Performance and Reliability

From Barnes and Noble
Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling / Edition 1
Barnes and Noble

Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling / Edition 1

From Barnes and Noble
Manufacturing Challenges in Electronic Packaging
Barnes and Noble

Manufacturing Challenges in Electronic Packaging

From Barnes and Noble
Failure Analysis: A Practical Guide for Manufacturers of Electronic Components and Systems / Edition 1
Barnes and Noble

Failure Analysis: A Practical Guide for Manufacturers of Electronic Components and Systems / Edition 1

From Barnes and Noble
Reliability and Failure of Electronic Materials and Devices / Edition 2
Barnes and Noble

Reliability and Failure of Electronic Materials and Devices / Edition 2

From Barnes and Noble
Structural Integrity and Reliability in Electronics: Enhancing Performance in a Lead-Free Environment
Barnes and Noble

Structural Integrity and Reliability in Electronics: Enhancing Performance in a Lead-Free Environment

From Barnes and Noble
Durability and Reliability of Polymers and Other Materials in Photovoltaic Modules
Barnes and Noble

Durability and Reliability of Polymers and Other Materials in Photovoltaic Modules

From Barnes and Noble
High-Frequency Characterization of Electronic Packaging / Edition 1
Barnes and Noble

High-Frequency Characterization of Electronic Packaging / Edition 1

From Barnes and Noble
Dielectric Breakdown in Gigascale Electronics: Time Dependent Failure Mechanisms
Barnes and Noble

Dielectric Breakdown in Gigascale Electronics: Time Dependent Failure Mechanisms

From Barnes and Noble
Interconnect Reliability Advanced Memory Device Packaging
Barnes and Noble

Interconnect Reliability Advanced Memory Device Packaging

From Barnes and Noble
Die-Attach Materials for High Temperature Applications Microelectronics Packaging: Materials, Processes, Equipment, and Reliability
Barnes and Noble

Die-Attach Materials for High Temperature Applications Microelectronics Packaging: Materials, Processes, Equipment, and Reliability

From Barnes and Noble
Hermeticity Testing of MEMS and Microelectronic Packages
Barnes and Noble

Hermeticity Testing of MEMS and Microelectronic Packages

From Barnes and Noble
Lead-Free Solder Interconnect Reliability
Barnes and Noble

Lead-Free Solder Interconnect Reliability

From Barnes and Noble
Freeform Optics for LED Packages and Applications / Edition 1
Barnes and Noble

Freeform Optics for LED Packages and Applications / Edition 1

From Barnes and Noble
Reliability of Power Electronic Converter Systems
Barnes and Noble

Reliability of Power Electronic Converter Systems

From Barnes and Noble
Powered by Adeptmind