Packaging of electronic components at microwave and millimeter wave frequencies requires the same level of engineering effort as lower frequency electronics plus a set of additional activities that are unique due to the higher frequency of operation. Without careful attention to these additional issues, it is not possible to successfully engineer electronic packaging at these bands. This new resource presents the electronic packaging issues unique to the microwave and millimeter-wave bands and reviews lower-frequently packaging techniques and how they can be tailored or analyzed for higher-frequently design. Readers are provided with 30 practical example, along with 2 free downloadable software analysis program.