Hermeticity Testing of MEMS and Microelectronic Packages in Bloomington, MN

Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to evolve. A step change in package requirements came with the introduction of the micro-electromechanical system (MEMS), whereby interactions with the external environment are, in some cases, required. This resource is a rapid, definitive reference on test methods for hermetic packaging for the MEMS and microelectronics industries, giving practical guidance on traditional and newly developed test methods. This book includes up-to-date and applicable test methods for today's package types. The authors cover the history and development of packaging, with a view to understanding hermeticity testing requirements and the subsequent limitations of these methods when applied to new package types.