This work explores the interplay among atomic arrangements, defects, and driving forces commonly encountered in solids used in bulk or thin film forms in determining diffusion and, ultimately, the reliability of materials used in advanced technologies. Gupta (Physical Sciences Division, IBM Thomas J. Watson Research Center) presents work documenting the results of the diffusive process in engineering materials studied both experimentally and using advanced computer simulations. Chapters are written by experts from international institutes and industrial research centers. The book will be useful to those in industry and academia. Annotation ©2004 Book News, Inc., Portland, OR