Characterization in Silicon Processing in Bloomington, MN

Characterization in Silicon Processing reviews characterization techniques of interest to silicon processing engineers. Increasingly stringent materials requirements, such as decreasing barrier film thicknesses, have prompted a need for improved materials quality and performance. In order to meet these high standards, process engineers must be familiar with modern techniques for characterization of microstructure and the relationship of microstructure to surface preparation and deposition techniques. This book covers the most recent advances in characterization, including: monitoring the effectiveness of surface cleaning processes such as morphology, residues, and chemical reactions; determining the amount of silicon consumption during barrier film and silicide growth on silicon; monitoring grain size and grain growth in aluminum—important for electromigration effects and in lithography; and silicon selective epitaxial growth.