The following text field will produce suggestions that follow it as you type.

Home

Barnes and Noble

High-Frequency Characterization of Electronic Packaging / Edition 1

Unfortunately, this item is no longer available, but we found some similar items you might like.

You May Also Like

Electronic Packaging Materials and Their Properties / Edition 1

Electronic Packaging Materials and Their Properties / Edition 1

Barnes and Noble
Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling / Edition 1

Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling / Edition 1

Barnes and Noble
Quality Conformance and Qualification of Microelectronic Packages and Interconnects / Edition 1

Quality Conformance and Qualification of Microelectronic Packages and Interconnects / Edition 1

Barnes and Noble
High-Frequency Magnetic Components / Edition 2

High-Frequency Magnetic Components / Edition 2

Barnes and Noble
Microelectronics Packaging Handbook: Technology Drivers Part I / Edition 2

Microelectronics Packaging Handbook: Technology Drivers Part I / Edition 2

Barnes and Noble
Microelectronics Packaging Handbook: Subsystem Packaging Part III / Edition 2

Microelectronics Packaging Handbook: Subsystem Packaging Part III / Edition 2

Barnes and Noble
Force Sensors for Microelectronic Packaging Applications / Edition 1

Force Sensors for Microelectronic Packaging Applications / Edition 1

Barnes and Noble
High-frequency Circuit Engineering

High-frequency Circuit Engineering

Barnes and Noble
Microelectronics Packaging Handbook on CD-ROM / Edition 2

Microelectronics Packaging Handbook on CD-ROM / Edition 2

Barnes and Noble
Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices

Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices

Barnes and Noble
High-Frequency and Microwave Circuit Design / Edition 2

High-Frequency and Microwave Circuit Design / Edition 2

Barnes and Noble
Electronic Packaging and Interconnection Handbook / Edition 4

Electronic Packaging and Interconnection Handbook / Edition 4

Barnes and Noble
Manufacturing Challenges in Electronic Packaging

Manufacturing Challenges in Electronic Packaging

Barnes and Noble
Flexible Electronic Packaging and Encapsulation Technology

Flexible Electronic Packaging and Encapsulation Technology

Barnes and Noble
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies / Edition 1

Advances in Embedded and Fan-Out Wafer Level Packaging Technologies / Edition 1

Barnes and Noble
Testing Active and Passive Electronic Components / Edition 1

Testing Active and Passive Electronic Components / Edition 1

Barnes and Noble
Powered by Adeptmind